Structural Analysis of Printed Circuit Board Systems
نویسندگان
چکیده
منابع مشابه
Finite element modeling of printed circuit board for structural analysis
Printed circuit boards having unfavorable deflection have been considered for a better mechanical design. During reflow process, pcb has experienced a range of the temperature between ambient temperature and peak temperature in furnace. Out of plane deflection is generated due to the property mismatch of material composition. Combination degree of board and copper plating will be researched for...
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 1993
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.2909340